Program 2018 "Making an impact!" (13.08.2018)

Poster

P01	F. Winkler (TU Dresden, DE) TSV Transistor – vertical metal gate FET inside a Through Silicon VIA
P02	A. Filbert (Furtwangen University, DE) Additive and Subtractive Fabrication Using Grayscale Lithography
P03	S. Killge (TU Dresden, DE) High-aspect-ratio through silicon VIAs (TSVs) for high-frequency application with th-ALD tantalum-based barrier layer, Ruthenium seed layer and subsequent copper electroplating
P04	D. Yu (Leibniz Institute for New Materials, DE) Roll-to-roll fabrication of mushroom-shaped micropatterned dry adhesives using flexible templates
P05	S. Charania (TU Dresden, DE) 3D optical TSV interconnects for high-frequency application on silicon interposer
P06	tba (ETH Zurich, CH) tba
P07	R. Kirchner (TU Dresden, DE) Anisotropic wet etching of silicon dioxide using a metal mask and hydrofluoric acid

October 4th, 2018 (Thursday)

08.00-10.00

Registration & Networking

10.00-10.10	Welcome
10.10-10.20	R. Kirchner (TU Dresden, DE) Opening
10.20-10:30	Announcements
10.30-11.00 Keynote	M. Wegener (Karlsruhe Institute of Technology, DE) 3D mechanical metamaterials by 3D laser nanoprinting

Session 1: High resolution 3D patterning (H. Schift)

11.00-11.30

Invited

H. Plank (Graz University of Technology, AT)

3D Nanoprinting via Focused Electron Beams

11.30-11.50

L. Jonusauskas (Vilnius Laser Center, LT)

Hybrid subtractive-additive femtosecond laser manufacturing of functional 3D structures: towards industrial applications

11.50-12.10

P.-I. Dietrich (Karlsruhe Institute of Technology, DE and Vanguard Photonics, DE)

3D-nanoprinting for photonic integration and packaging – from lab to fab

12.10-12.30

D. Colle (Heidelberg Instruments GmbH, DE)

Gray scale lithography: Creating complex 2.5D structures in thick photoresist by direct laser writing

12.30-13.30

Lunch & Networking

Session 2: 3D Origami and self-assembly (A. Knoll)

13.30-14.00

Invited

W. Cheng (Monash University, AU)

Plasmene Origami

14.00-14.20

K. Zimmer (Leibniz-Institut für Oberflächenmodifizierungen e.V., DE)

Origami folding of laser-cut polymer foils

14.20-14.40

R. Kirchner (TU Dresden, DE)

Towards programable polymer-based actuators for origami MEMS actuation

14.40-15.00

H. Schift (Paus Scherrer Institute, CH)

Self-assembled conductive wires for printed electronics

15.00-16.00

Poster & Networking

Session 3: 3D replication (R. Kirchner)

16.00-16.30

Invited

B. Voisiat (TU Dresden)

Direct laser interferrence patterning for roll-to-roll processing

16.30-16.50

M. Tormen (Thunder NIL srl and National Research Council CNR, IT)

Origination and replication of 3D hierarchical micro and nanostructures by Pulsed-NIL technology

16.50-17.10

B. Stender (Multiphoton Optics GmbH, DE)

High Precision 3D Printing – diversity of fabrication modes and applications

17.10-17.30

S. Martens (IMS Chips, DE)

Challenges of Greyscale Lithographie

19.00-22.00

Evening event

October 5th, 2018 (Friday)

Session 4: 3D Additive Fabrication and Systems (J. Brugger)

09.00-09.30

Invited

O. Schmidt (Leibniz Institute for Solid State and Materials Research Dresden, DE and Chemnitz University of Technology, DE)

3D microtubular architectures and devices

09.30-09.50

P. Karvinen (Finnlitho Ltd and University of Eastern Finland, FI)

3D printing of freeform optics

09.50-10.10

M. Henke (TU Dresden)

Autonomous Soft Robots

10.10-10.30

S. Charania (TU Dresden, DE)

Ultra high speed 3D optical interconnects on Silicon Interposer

10.30-11.30

Poster & Networking

Session 5: Thermal Scanning Probe Lithography (O. Schmidt)

11.30-12.00

Invited

J. Brugger (École polytechnique fédérale de Lausanne, CH)

Nano-engineering using a heated scanned probe

12.00-12.20

Y. K. R. Cho (Instituto de Ciencia de Materiales de Madrid, ES)

Oxidation scanning probe lithography in 2D materials

12.20-12.40

A. Knoll (IBM Research Zurich, CH)

Nanofluidic rocking Brownian motors

12.40-13.00

Z. Wu (SwissLitho AG, CH)

NanoFrazor Lithography for 3D masters at single-nm resolution

13.00-13.20

Live Performance with Grand Piano

Mr. Dishant Sangani

13.20-15.00

Lunch, Networking & Closing

Past years programes

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